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| (R) EMIF08-2005QEJ EMI FILTER INCLUDING ESD PROTECTION IPADTM APPLICATIONS: Where EMI filtering in ESD sensitive equipment is required : Computers and printer Communication systems Mobile phones DESCRIPTION The EMIF08-2005QEJ is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. Additionally, the EMIF08-2005QEJ filter includes an ESD protection circuitry which prevents destruction when subjected to ESD discharge up to 15kV. BENEFITS EMI symmetrical low-pass filter 2 Low PCB space consuming: 9 mm Very thin package < 1 mm High reliability offered by monolithic integration COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2: 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-7 Class 3: 25kV (human body test) 16 15 14 13 1 2 3 4 12 11 10 9 5 6 7 8 QFN 3x3mm 16 pins Table 1: Order Code Part Number EMIF08-2005QEJ Figure 2: Pin Configuration Low-pass Filter Input Output Marking EM08 1 Low-pass Filter Input Output 16 2 Low-pass Filter Input Output 15 3 Low-pass Filter Input Output 14 4 Figure 3: Basic Cell Configuration Input Low-pass Filter Output 13 5 Low-pass Filter Input Low-pass Filter Output 12 Input Output 6 Low-pass Filter Input Output 11 7 R = 200 C = 50pF max. Low-pass Filter Input Output 10 8 9 TM: IPAD is a trademark of STMicroelectronics. April 2005 REV. 4 1/6 EMIF08-2005QEJ Table 2: Absolute Ratings (Tamb = 25C) Symbol VPP Tj Tstg TL ESD discharge Junction temperature Storage temperature range Maximum lead temperature for soldering Parameter and test conditions EC61000-4-2 air discharge IEC61000-4-2 contact discharge Value 15 8 125 - 55 +150 260 Unit kV C C C Table 3: Electrical Characteristics (Tamb = 25 C) Symbol VBR IRM VRM VCL IPP T VF RI/O Cline Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Voltage temperature coefficient Forward voltage drop Series resistance between Input & Output Input capacitance per line Slope = 1/Rd IPP VBR VCL VRM IRM VF V I IF Symbol VBR IRM Rd RI/O Cin IR = 1 mA VRM = 3V per line Test conditions Min. 6 Typ. 8 Max. 10 500 Unit V nA IPP = 10A, tp = 2.5s 180 Vbias = 0V F = 1MHz Vosc = 30mV 1 200 45 220 50 pF 2/6 EMIF08-2005QEJ Figure 3: Filtering behavior EMIF08: S21(dB) response Aplac 7.62 User: STMicroelectronics Nov 05 2002 Figure 4: Capacitance versus reverse applied voltage CLine(pF) 60 50 40 -5.00 -10.00 -15.00 30 C(V) -20.00 -25.00 -30.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VR(V) EMIF08-2005QEJ Figure 5: Ordering Information Scheme EMIF EMI Filter Number of lines Information x = resistance value / 10(Ohms) z = capacitance value / 10(pF) Package QEJ = QFN 3mm x 3mm 08 - xx zz QEJ 3/6 EMIF08-2005QEJ Figure 6: QFN Package Mechanical Data DIMENSIONS A3 A1 D b e L A REF. A A1 A3 b D D2 E E2 Millimeters Min. 0.80 0 0.20 0.18 3.00 1.25 3.00 1.25 0.50 0.20 0.30 0.40 0.008 1.55 0.049 1.55 0.049 0.30 0.007 Typ. Max. 0.05 Min. 0 1.00 0.031 Inches Typ. Max. 0.039 0.002 0.008 0.012 0.118 0.061 0.118 0.061 0.020 E E2 e K L D2 0.50 0.012 0.016 0.020 Figure 7: Foot Print Dimensions (in millimeters) 0.30 0.30 1.00 1.40 4/6 EMIF08-2005QEJ Table 4: Ordering Information Ordering code EMIF08-2005QEJ Marking EM08 Package QFN 3x3 16 pins Weight 22.1 mg Base qty 3000 Delivery mode Tape & reel Table 5: Revision History Date Dec-2002 03-Jan-2005 Revision 2A 3 Last issue. Minor template update. No content change. QFN package mechanical data update: 1/ References A typ., A1 typ., b typ. D2 typ. and E2 typ. removed. 2/ Reference D2 changed from 0.25 min. to 1.25 min. and from 1.25 max. to 1.55 max. 3/ Reference E2 changed from 0.25 min. to 1.25 min. and from 1.25 max. to 1.55 max. 4/ Footprint updated, in compliance with IPC-SM-782. Description of Changes 01-Apr-2005 4 5/6 EMIF08-2005QEJ Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6 |
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